Stealth Dicing Contract Processing Service
A device that dislikes moisture! Laser cutting technology with a completely dry process.
Our company offers contract processing services for stealth dicing. "Stealth laser dicing" is a technology that performs localized laser processing inside the material, allowing the substrate to be divided through expansion. Since it cuts only the interior without damaging the wafer surface, chipping on the back side of the chip is minimized. Additionally, as it is a completely dry process, it is suitable for devices that are sensitive to moisture and for contamination prevention. 【Features】 ■ Supported sizes: φ2 to φ8 inches ■ Capable of handling small quantities ■ Particularly effective for cutting thin silicon wafers ■ High-speed cutting is possible ■ Improved throughput and yield *For more details, please refer to the PDF document or feel free to contact us.
- Company：アシストナビ
- Price：Other
